In the rapidly advancing semiconductor sector, thermal management of chips remains a pivotal concern. Inherent heat generation during their operation can lead to a range of issues such as potential thermal runaway, diminished lifespan, and current leakage. To mitigate these challenges, the study introduces a superhygroscopic hydrogel embedded with metal ions. Capitalizing on intrinsic coordination chemistry, the metallic ions in the hydrogel form robust coordination structures with non-metallic nitrogen and oxygen through empty electron orbitals and lone electron pairs. This unique structure serves as an active site for water adsorption, beginning with a primary layer of chemisorbed water molecules and subsequently facilitating multi-layer physisorption via Van der Waals forces. Remarkably, the cobalt-integrated hydrogel demonstrates the capability to harvest over 1 and 5 g g⁻¹ atmospheric water at 60% RH and 95% RH, respectively. Furthermore, the hydrogel efficiently releases the entirety of its absorbed water at a modest 40°C, enabling its recyclability. Owing to its significant water absorption capacity and minimal dehydration temperature, the hydrogel can reduce chip temperatures by 5°C during the dehydration process, offering a sustainable solution to thermal management in electronics.

中文翻译：

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钴离子超吸湿水凝胶用作芯片散热器，通过蒸发冷却实现 5 °C 温度降低

在快速发展的半导体领域，芯片的热管理仍然是一个关键问题。运行期间产生的固有热量可能会导致一系列问题，例如潜在的热失控、寿命缩短和电流泄漏。为了缓解这些挑战，该研究引入了一种嵌入金属离子的超吸湿水凝胶。利用内在的配位化学，水凝胶中的金属离子通过空电子轨道和孤电子对与非金属氮和氧形成强大的配位结构。这种独特的结构作为水吸附的活性位点，从化学吸附水分子的主层开始，随后通过范德华力促进多层物理吸附。值得注意的是，钴集成水凝胶表现出分别在 60% RH 和 95% RH 下收集超过 1 gg -1 和 5 gg ^-1大气水的能力。此外，水凝胶在 40°C 的适度温度下可有效释放其全部吸收的水，从而实现其可回收性。由于其显着的吸水能力和最低的脱水温度，水凝胶可以在脱水过程中将芯片温度降低5°C，为电子产品的热管理提供可持续的解决方案。