This study employs X‐ray photoelectron spectroscopy (XPS), thickness measurements, permeation analysis and laser scanning microscopy to analyse the stretch tolerance in dependence of the chemical composition and deposition rates of plasma‐enhanced chemical vapour deposition coatings. SiOx and SiOCH coatings are deposited on polyethylene terephthalate film using a full factorial study design of three parameters (monomer/oxygen mass flow and pulse duration). They exhibit distinct differences, with the monomer mass flow emerging as a critical factor influencing deposition rates and stretch tolerance. SiOCH coatings demonstrate faster growth rates due to higher monomer flow. SiOx coatings exhibit superior barrier performance. Stretch tolerance does not solely correlate with atomic composition, since a SiOx coating with higher‐than‐predicted stretch tolerance was observed.

中文翻译：

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用于可持续软包装的耐拉伸 PECVD 气体阻隔涂层

本研究采用 X 射线光电子能谱 (XPS)、厚度测量、渗透分析和激光扫描显微镜来分析拉伸公差与等离子体增强化学气相沉积涂层的化学成分和沉积速率的关系。二氧化硅X使用三个参数（单体/氧气质量流量和脉冲持续时间）的全析因研究设计，将 SiOCH 涂层沉积在聚对苯二甲酸乙二醇酯薄膜上。它们表现出明显的差异，单体质量流量成为影响沉积速率和拉伸公差的关键因素。由于单体流量较高，SiOCH 涂层表现出更快的生长速率。二氧化硅X涂层表现出优异的阻隔性能。拉伸容差不仅仅与原子组成相关，因为 SiO2X观察到涂层的拉伸耐受性高于预期。