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Dual-Cation CuAgSe-Based Material: Rapid Mass Transfer in Synthesis and High Thermoelectric Performance Realization
ACS Applied Materials & Interfaces ( IF 9.5 ) Pub Date : 2024-04-23 , DOI: 10.1021/acsami.4c02217
Yongzhong Jia 1 , Dongwang Yang 1 , Mingqi Zhang 1 , Hao Luo 1, 2 , Lin Liao 1, 2 , Yu Zheng 1 , Bachir Melzi 1 , Junhao Li 1 , Yutian Liu 1 , Yuting Wang 1 , Yonggao Yan 1 , Xinfeng Tang 1
Affiliation  

Understanding mass transfer mechanisms is vital for developing new material synthesis and densification technologies. Ion transport, serving both mass and charge transfer, is essential for the rapid preparation of high-performance fast ionic conductor thermoelectric materials like Zn4Sb3 and Cu2Q (Q = S, Se). In the case of dual-cation fast ion conductor materials like CuAgSe, exploring the relationship between cation transport becomes pertinent. In this study, copper (Cu) and selenium (Se) undergo a reaction in the presence of an electric field (∼15 A), resulting in the formation of the CuSe compound. Subsequent to this initial reaction, a subsequent thermal environment facilitates the interaction among Cu, CuSe, and Ag2Se, culminating in the rapid formation and densification of CuAgSe (with a relative density exceeding 99%) in just 30 s. Evidently, the diffusion of copper ions substantiates a pivotal role in facilitating mass transfer. As a result, CuAg1+xSe samples with different silver contents (x = 0.01, 0.02, 0.03, 0.04 and 0.05) can effectively inhibit cation vacancy, and introduce highly ordered Ag nanotwins to enhance the electrical transport performance. For CuAg1.04Se, a peak ZT value of 1.0 can be achieved at 673 K, which is comparable to the literatures. This work will guide the future electric field-assisted rapid mass transfer of materials.

中文翻译:

双阳离子 CuAgSe 基材料:合成中的快速传质和高热电性能的实现

了解传质机制对于开发新材料合成和致密化技术至关重要。离子传输同时服务于质量和电荷传输,对于快速制备高性能快速离子导体热电材料如Zn 4 Sb 3和Cu 2 Q (Q = S, Se) 至关重要。对于像 CuAgSe 这样的双阳离子快离子导体材料,探索阳离子传输之间的关系变得有意义。在这项研究中,铜 (Cu) 和硒 (Se) 在电场 (∼15 A) 下发生反应,形成 CuSe 化合物。在此初始反应之后,随后的热环境促进了 Cu、CuSe 和 Ag 2 Se 之间的相互作用,最终在短短 30 秒内快速形成和致密化 CuAgSe(相对密度超过 99%)。显然,铜离子的扩散在促进传质方面发挥着关键作用。结果,不同银含量(x = 0.01、0.02、0.03、0.04和0.05)的CuAg 1+ x Se样品可以有效抑制阳离子空位,并引入高度有序的Ag纳米孪晶以增强电传输性能。对于 CuAg 1.04 Se,在 673 K 时可以达到 1.0 的峰值 ZT 值,与文献相当。这项工作将指导未来电场辅助材料的快速传质。
更新日期:2024-04-23
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