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Search for a Dual-Convergence Sparse Feature Extractor With Visualization Vibration Signals Architecture Feature for Flip-Chip Defect Detection
IEEE Transactions on Industrial Informatics ( IF 12.3 ) Pub Date : 2024-05-03 , DOI: 10.1109/tii.2024.3393553 Yu Sun 1 , Lei Su 1 , Jiefei Gu 1 , Xinwei Zhao 1 , Ke Li 1 , Michael Pecht 2
中文翻译：
寻找具有可视化振动信号架构特征的双收敛稀疏特征提取器，用于倒装芯片缺陷检测
更新日期：2024-05-03
IEEE Transactions on Industrial Informatics ( IF 12.3 ) Pub Date : 2024-05-03 , DOI: 10.1109/tii.2024.3393553 Yu Sun 1 , Lei Su 1 , Jiefei Gu 1 , Xinwei Zhao 1 , Ke Li 1 , Michael Pecht 2
Affiliation
中文翻译：
寻找具有可视化振动信号架构特征的双收敛稀疏特征提取器，用于倒装芯片缺陷检测
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