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Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-17 Paolo Manfredi
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On-Chip Sensors for Temperature Monitoring of Packaged GaN MMICs IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-15 Andreas Divinyi, Torbjörn M.J. Nilsson, Niklas Rorsman, Tobias Kristensen, Harald Hultin, Sten E. Gunnarsson, Mattias Thorsell
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Experimental Study on Crack Propagation of Adhesive Layer within Mini-LED Chips Needle-ejecting Peeling-off Transfer Mode IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Li Ma, Yanhui Chen, Yun Chen, Wanqun Chen, Xin Chen, Maoxiang Hou, Ching-Ping Wong, Yan Niu, Minghui Yao
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Multi-physics effect of temperature and humidity on copper wire bond degradation via enthalpy-based water-vapour energy IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Michael Joo Zhong Lim, Hai Guan Loh, Michael Goroll, Zhong Chen, Chuan Seng Tan
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Metrology of Silicon Wafers through Synchrotron Section Topography and X-ray Diffraction Imaging IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Xiao Xin, Nima E. Gorji, Ming-Lang Tseng
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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Tim Pfahler, Sascha Breun, Lukas Engel, Christian Geissler, Jan Schür, Martin Vossiek
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Reliability Evaluation of Isolated LDMOS Devices and Condition Monitoring Solution IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Rahman Sajadi, Chi Xu, Bhanu Teja Vankayalapati, Masoud Farhadi, Bilal Akin
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Design and Fabrication of a TR Microsystem in Ka Band with Si-Based 3D Heterogeneous Integration IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-09 Faxin Yu, Xi Guo, Siyuan Ma, Chenge Wang, Guangjian Feng, Zhiyu Wang
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The Temperature Cycling Characteristic of Copper Pillar Solder Joints IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-08 Yong Wang, Shifeng Yu, Junhui Li
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Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-08 Rahman Sajadi, Enes Ugur, Masoud Farhadi, Bhanu Teja Vankayalapati, Ali Saadat, William G. Vandenberghe, Bilal Akin
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Efficient Electro-Thermal Analysis of SIW Filters Considering Temperature-Dependent Characteristics of Materials IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-05 Zehao Zheng, Min Tang, Lin-Sheng Wu, Liang-Feng Qiu, Junfa Mao
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Converter-Level Packaging and Optimization for a SiC-based Grid-Interface Converter Using Discrete Devices IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-05 Abdul Basit Mirza, Kushan Choksi, Austin Zhou, Sama Salehi Vala, Fang Luo
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A Composite Probe with Parasitic Elements for Improving Sensitivity and Simultaneously Measuring Electric- and Magnetic-Fields IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-05 Lei Wang, Rong Zhou, Xiaoxian Liu, Zhangming Zhu
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77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar with Horizontally and Vertically Long and Medium Range Sensing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 M. Sun, T. G. Lim, D. S. Wee Ho, J. Q. Wu, T. C. Chai, Y. G. Ma
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Effects of Non-Gaussian Surface Roughness on Conductor Loss in High-Frequency Transmission Lines IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 Zhaokai Yang, Yixue Zhu, Hongquan Jiang, Hongwei Bao, Fei Ma
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Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 Yanghe Liu, Ercan M. Dede, Shahid Aziz Khan, Guanliang Liu, Abhilash Kamineni, Jae Seung Lee, Mengqi Wang
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High-Efficiency Low-Pass Reflectionless Filter Based on Modal Decomposition and Electromagnetic Absorber IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 Yevgeniy S. Zhechev, Mikhail S. Murmansky, Sergey V. Vlasov, Vyacheslav A. Trubcheninov, Nikita O. Kuzmin, Nikita S. Pavlov
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Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned Films IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-28 Tung-Han Chuang, Yen-Ting Chen, Yin-Hsuan Chen, Chia-Ching Chu, Chao-Sung Lin
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Sensitivity Enhancement of Microwave Split-Ring-Resonator Sensors IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-27 Mehdi Nosrati, Farzad Soltanian, Amir Nosrati
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Reliability of X7R MLCCs Under Alternating Polarity Highly Accelerated Lifetime Testing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-27 Jonathan Bock, Will Bachman, Scott Ehlers, Jack Flicker
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Two-Branch Coupling Cauer Model in IGBT Module Considering FWD Thermal Coupling Effect IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-27 Qing Yan, Aoyang Li, Gengji Wang, Jinliang Yin, Chao Dong, Mingxing Du
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High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress-Strength Interference Modeling IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Tao Zhang, Xiaopeng Wu, Guangbao Shan, Yikang Wang, Jiahao Hou, Yintang Yang
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“No-clean” flux residues detection with impedance measurements IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Zsolt Tóth, Eszter Kocsis, Attila Lukács, István Szalai
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Formation of Wavy Crack in Double Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Daisuke Yasugi, Keisuke Wakamoto, Yuga Kumakiri, Takahiro Namazu
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Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Sukrut Prashant Phansalkar, Bongtae Han
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Simulation calculation and experimental study on the properties of Re, In, and Nb-doped Ag/Ni electrical contact materials IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-25 Jingqin Wang, Menghan Wang, Yixuan Zhang
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Pin-opt: Graph Representation Learning for Large-scale Pin Assignment Optimization of Microbumps considering Signal and Power Integrity IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-25 Joonsang Park, Seonguk Choi, Keeyoung Son, Junghyun Lee, Taein Shin, Keunwoo Kim, Boogyo Sim, Seongguk Kim, Jihun Kim, Jiwon Yoon, Youngwoo Kim, Joungho Kim
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Thermomechanical Stress Analysis, Characterization and Optimization for Double-Side Cooled Power Modules with Ceramic Substrate IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-25 Bingyang Li, Xu Yang, Kangping Wang, Min Wu, Wenjie Chen
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Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-22 Zichen Zhang, Emmanuel Arriola, Carl Nicholas, Justin Lynch, Nick Yun, Adam Morgan, Woongje Sung, Khai D.T. Ngo, Guo-Quan Lu
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3-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-21 Andoniaina M. Randriambololona, Vivek Manepalli, Rachel C. McAfee, Bidisha Ojha, Rahi Miraftab-Salo, Kidus Guye, Hyoungsoon Lee, Samuel Graham, Damena Agonafer
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Embedded PIN-Diode Die Interconnections with Aerosol-Jet Printing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-21 Stephen Gonya, Mohammed Alhendi, Emuobosan Enakerakpo, Mark D. Poliks, Tom Rovere, Joseph Jendrisak, Michael Geyer, Daniel Hines
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Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-20 Adlil Aizat Ismail, Maria Abu Bakar, Azman Jalar, Zol Effendi Zolkefli, Erwan Basiron, Muhammad Nizam Ilias
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Using Particle Image Velocimetry to Visualize Jet Impingement Flow Mechanics on Modified Surfaces IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-20 Aaron H Smith, Sushil H Bhavnani, Roy W Knight
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Two-Step Ar/N2 Plasma Treatment on SiO2 Surface for Cu/SiO2 Hybrid Bonding IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-19 Sangwoo Park, Sangmin Lee, Sarah Eunkyung Kim
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Thermal Management of Non-Uniform Heat Fluxes in an Electric-Vehicle Fast-Charger: Experimental and Numerical Analysis IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-18 Joshua Palumbo, Omri Tayyara, Seyed Amir Assadi, Carlos M. Da Silva, Olivier Trescases, Cristina H. Amon, Sanjeev Chandra
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Flip Chip Bonding for SiC Integrated Circuits with Gold Stud Bumps for High Temperature Up to 600°C Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-18 Feng Li
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Packaged Microwave Displacement Sensors With Wideband Filtering Function IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-14 Zhuowei Zhang, Gang Zhang, Kam-Weng Tam, Chi-Hou Chio, Xin Zhou, Cheng Teng, Ngai Kong
In this letter, a novel packaged linear displacement sensor integrated with inherent bandpass filter (BPF) is presented. The proposed filtering sensor is composed of a multimode resonator (MMR) and a pair of transmission line. Based on the insertion phase shifts, a displacement sensing function can be obtained along with a wideband bandpass filtering response. For verification, a prototype is simulated
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A Synthesis Theory of Stripline Dual-Band Filtering Power Divider with Controllable Full-frequency Isolation IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-13 Taiyang Xie, Xiaolong Wang, Lei Zhu, Geyu Lu
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Origami-Driven Manufacturing of Reflectarrays or Transmitarrays with Feeds and Fixture IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Kuan-Yu Ko, Fei-Peng Lai, Yen-Sheng Chen
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Influence of inhomogeneous anisotropic Copper grains in TSV on the thermo-mechanical behaviors in the annealing process IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Yunpeng Zhang, Can Sheng, Shizhao Wang, Tianjian Liu, Zhongjie Gao, Sheng Liu
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Design of Absorptive Common-Mode Filters Based on Coupled Stripline λ/4 Resonator IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Yi-Hao Ma, Yu-Bin Chen, Qi-Qiang Liu, Wen-Sheng Zhao
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A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-08 Luqiao Yin, Ao Wang, Wenxing Zhu, Aiying Guo, Jingjing Liu, Min Tang, Liang Chen, Jianhua Zhang
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Solar-Thermal Synthesized Graphitic Heat Spreader for Thermally Enhanced Organic Substrates IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-07 Min Jong Kil, Eythan Lam, Mostafa Abuseada, James F. Buckwalter, Timothy S. Fisher
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Effect of warpage on solder joint fatigue life by influencing the solder joint shape in BGA packages IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-05 Wei Shen, Zhenyang Lei, Kang Liang, Gai Wu, Tian Zeng, Sheng Liu
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Research on high-precision oxygen partial pressure sensor based on TDLAS technology IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-05 Feng He, Songhui Li, Bing Liu, Zhong Jin, Jinyu Li, Fangting Liu, Junhui Li
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Silicate-Based Packaging Materials for Heterogeneous Integration of Microsystems IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Ryan T. Benz, Devon Beck, Connor Belanger, Al Cabral, Matthew Ricci, Carl V. Thompson, Bradley Duncan
Heterogeneous integration (HI) represents the cutting edge of microelectronic design and fabrication. However, the limitations of current, organic polymer-based packaging materials (PMs) prevent implementation of this assembly technology. Building on the previous work, an improved silicate-based PM for 3-D HI of microelectronics with a focus on mmWave RF applications was developed. The sodium-free
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A Micro SOI Pressure Sensor With Compensation Hole for High Temperature Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Fangting Liu, Feng He, Xin Tang, Junhui Li
In order to accurately measure the working pressure parameters of various levels of gas and lubricating oil in aviation engines, each engine requires a large number of pressure sensors that are small in size and can work stably in high-temperature environments. The maximum theoretical operating temperature of the silicon on insulator (SOI) pressure sensor is 500 °C, and this article uses a SOI substrate
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Design and Transient Analysis of a 650 V/150 A GaN Power Modules With Integrated Bias Power and Gate-Drive Circuit IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Liyan Zhu, Yu Yan, Hua Bai
This article focuses on the design of a 650 V/150 A gallium nitride (GaN) power module. Direct bonded copper (DBC) is employed for the thermal pad insulation and the printed circuit board (PCB) is adopted for the flux cancellation, isolated bias power supply, and gate-drive-circuit integration. The packaged module exhibits high current capability (>150 A), high compactness ( $45\times 33\times9.6$
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Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Nick Baker, Laurent Dupont, Szymon Michal Beczkowski, Francesco Iannuzzo