21 February 2020 Improved MEMS piezoelectric vibratory stage with reduced off-axis error
Rui Hao, Bei Peng, Huijun Yu, Hu Zhao, Wu Zhou
Author Affiliations +
Abstract

Background: The piezoelectric microvibratory stage as a microelectromechanical system (MEMS) actuator can tilt around the X  /  Y axis and translate along the Z axis. However, when the vibratory stage is tilted around the X axis, it also has an undesirable tilting angle around the Y axis. It means that the X axis tilting and the Y axis tilting are not independent; therefore, it is significant to eliminate the coupling of two motions.

Aim: The coupling of X  /  Y tilting motion is studied theoretically and decoupled by optimization of structural parameters.

Approach: A structural model was established to analyze the reasons of the X  /  Y tilting coupling. Reasonable structure parameters of L-shaped piezoelectric beam were designed to eliminate the off-axis errors caused by X  /  Y tilting coupling.

Results: The reason of X  /  Y tilting coupling is that the stiffness of the L-shaped piezoelectric support beam mismatch in the X axis and Y axis directions. The appropriate width ratio of the two segments of the L-shaped piezoelectric beam can reduce the off-axis error effectively.

Conclusions: The test results show that the piezoelectric MEMS vibratory stage can achieve X  /  Y tilting motion with the relative off-axis error only at 1%.

© 2020 Society of Photo-Optical Instrumentation Engineers (SPIE) 1932-5150/2020/$28.00 © 2020 SPIE
Rui Hao, Bei Peng, Huijun Yu, Hu Zhao, and Wu Zhou "Improved MEMS piezoelectric vibratory stage with reduced off-axis error," Journal of Micro/Nanolithography, MEMS, and MOEMS 19(1), 015002 (21 February 2020). https://doi.org/10.1117/1.JMM.19.1.015002
Received: 31 October 2019; Accepted: 3 February 2020; Published: 21 February 2020
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CITATIONS
Cited by 2 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Ferroelectric materials

Silicon

Error analysis

Reactive ion etching

Semiconducting wafers

Deep reactive ion etching

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