The preparation of anisotropic conductive paste and its application in FOB interconnection
Microelectronics International
ISSN: 1356-5362
Article publication date: 17 February 2023
Issue publication date: 17 March 2023
Abstract
Purpose
The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system.
Design/methodology/approach
Differential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints and 90º peel adhesion were tested before and after high temperature and high humidity test (85°C, 85% humidity), thermal cycling (−45°C∼125°C, 30min/cycle) and pressure cooker test (PCT, 121°C, 100% humidity 2 atm) to evaluate the flex on board (FOB) interconnection reliability.
Findings
It is found that FOB test vehicles have been successfully bonded by using ACP for the first time. And the ACP bonding joint of FOB has good reliability and can meet the requirements of FOB interconnection. Compared with conventional anisotropic conductive film (ACF), this ACP interconnection provides higher adhesion strength, higher joint current carrying capability and higher reliability performance and lower cost for FOB interconnection.
Originality/value
ACP is applied in the interconnection of FOB. It has the higher reliability performance and lower cost for than the conventional ACF.
Keywords
Acknowledgements
The support from National Key Research and Development Program of China (2020YFE0205304), Key Laboratory of Silicon Device Technology of Chinese Academy of Sciences (KLSDTJJ2022-5), Chongqing Natural Science Foundation of China (cstc2021jcyj-msxmX1002), and Basic Research Funds for Central Universities (AUGA5710051221) is highly appreciated. And thanks is also extended to Dr Shuye Zhang for his support in this work.
Citation
Cai, X., Zhai, A., Zhou, C. and Paik, K.-W. (2023), "The preparation of anisotropic conductive paste and its application in FOB interconnection", Microelectronics International, Vol. 40 No. 2, pp. 166-171. https://doi.org/10.1108/MI-11-2022-0187
Publisher
:Emerald Publishing Limited
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