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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials

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Abstract

An experimental investigation was conducted to prepare and study the thermal conductivity performance of copper and diamond composite materials. Copper powder and diamond particles were used as fillers, epoxy resin was used as matrix, and composite materials were prepared by vacuum-assisted mechanical stirring. The thermal expansion coefficient of different composite materials was measured by a laser flash method, which can be used to calculate the thermal conductivity. The effect of the filling rate of copper powder, the morphology of copper powder, the filling rate of diamond, and the thermal conductivity of the particles on the thermal conductivity of composite materials was studied. The results showed that thermal conductivity of copper powder and diamond particles composite materials were 874% and 535% higher than that of the epoxy resin when their filling rates were 50.3 vol.% and 40.0 vol.%, respectively. For two-dimensional flake copper powder materials, the thermal conductivity could be effectively improved at a lower filling rate. However, the flake particles were easy to aggregate at a high filling rate, which maybe cause the composite materials to pulverize.

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The data that support the findings of this study are available from the corresponding author upon reasonable request.

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Funding

This work is supported by the National Natural Science Foundation of China (No. 51976163), Open Project of the State Key Laboratory of Superabrasives (GXNGJSKL-2022–02), the Fundamental Research Funds for the Central Universities (No. XTR052022011), Joint Funds of the National Natural Science Foundation of China (U2141218) and Young Talent Support Plan of Xi’an Jiaotong University.

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Authors and Affiliations

  1. State Key Laboratory of Superabrasives, Zhengzhou, 450001, China

    Shuai Wang & Bin Li

  2. School of Chemical Engineering and Technology, Xi’an Jiaotong University, No.28, Xianning West Road, Xi’an, Shaanxi, 710049, People’s Republic of China

    Xiang Ma, Quan Gao, Jinyu Wang, Yonghai Zhang & Jinjia Wei

  3. Shanxi Key Laboratory of Chemical Product Engineering, College of Chemical Engineering and Technology, Taiyuan University of Technology, Taiyuan, 030024, China

    Na Xu

  4. Key Laboratory of Microgravity, Institute of Mechanics, Chinese Academy of Sciences, Beijing, 100190, China

    Jianfu Zhao

  5. School of Engineering Science, University of Chinese Academy of Sciences, Beijing, 100049, China

    Jianfu Zhao

Authors
  1. Shuai Wang
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  2. Xiang Ma
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  3. Quan Gao
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  4. Jinyu Wang
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  5. Na Xu
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  6. Yonghai Zhang
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  7. Jinjia Wei
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  8. Jianfu Zhao
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  9. Bin Li
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Contributions

S. Wang and B. Li provided conceptualization, methodology and project administration. X. Ma, Q. Gao and J.Y. Wang did the investigation and formal analysis, which also wrote the main manuscript text. N. Xu, Y.H. Zhang, J.J. Wei and J.F. Zhao provide conceptualization and resources, and they reviewed and edited the manuscript text.

Corresponding authors

Correspondence to Xiang Ma or Na Xu.

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This study was approved by the State Key Laboratory of Superabrasives, Xi’an Jiaotong University, Taiyuan University of Technology, Institute of Mechanics and University Chinese Academy of Sciences.

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Wang, S., Ma, X., Gao, Q. et al. Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials. Microgravity Sci. Technol. 35, 57 (2023). https://doi.org/10.1007/s12217-023-10082-9

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