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Nano-Sized Copper Films Prepared by Magnetron Sputtering

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Abstract

Copper films with a thickness varying from 6 nm to 100 nm are prepared by magnetron sputtering. The films are characterized by homogeneous and fine-grained microstructure. The X-ray diffraction data confirm formation of a copper fcc phase orientated predominantly in the (111) direction. Depending on the growth conditions, the size of Cu grains in the films varies from 7 nm to 20 nm. The refractive index of the films increases from 0.52 to 1.22 with decreasing copper film thickness. The transmittance of the films decreases as their thickness increases from 6 nm to 62 nm, and the transparency of the films with the same thickness decreases with increasing sputtering power and decreasing argon flow rate. The surface resistivity of the films decreases from 8.89±0.06 Ω/sq to 1.47±0.01 Ω/sq as their thickness increases from 20 nm to 70 nm.

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Funding

The study was funded by the Russian Science Foundation (project No. 23-79-00026, https://rscf.ru/project/23-79-00026/) using facilities of the Shared Research Center “National Center of Investigation of Catalysts” at Boreskov Institute of Catalysis, Siberian Branch of Russian Academy of Sciences.

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  1. Nikolaev Institute of Inorganic Chemistry, Siberian Branch, Russian Academy of Sciences, Novosibirsk, Russia

    V. S. Sulyaeva, V. R. Shayapov, M. M. Syrokvashin, A. K. Kozhevnikov & M. L. Kosinova

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  1. V. S. Sulyaeva
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Russian Text © The Author(s), 2023, published in Zhurnal Strukturnoi Khimii, 2023, Vol. 64, No. 12, 121572.https://doi.org/10.26902/JSC_id121572

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Sulyaeva, V.S., Shayapov, V.R., Syrokvashin, M.M. et al. Nano-Sized Copper Films Prepared by Magnetron Sputtering. J Struct Chem 64, 2438–2450 (2023). https://doi.org/10.1134/S0022476623120156

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