Abstract
SiOx-based resistive switching (RS) cells composed of Cu as the active electrode were fabricated on flexible muscovite mica flakes using DC and radio frequency magnetron sputtering techniques. In one set of the metal–insulator–metal (MIM) devices, Cu-nanoparticles (Cu-NPs) have been embedded into the SiOx layer and their RS properties have been compared with the devices without the Cu-NPs. All the devices exhibited forming free bipolar RS characteristics. Room temperature DC current–voltage (I–V) measurements suggest improved resistance windows for the Cu-NP-embedded MIM devices. Analysis of the DC I–V characteristics suggests electrochemical metallization-driven RS, where current conduction follows Ohmic and space-charge-limited conductions mechanism for low and high resistance states, respectively. The resistance windows of the Cu-NPs-embedded MIM structures tested for multiple cycles do not degrade under different bending conditions, indicating their mechanical robustness for potential flexible device applications.
Similar content being viewed by others
References
Bonin K D, Edge R, Weller E F, Park M, Schuck P, Clemenger K et al 2003 Science 300 1269
Environ E, Gwon H, Kim H, Lee U, Seo D, Park C et al 2011 Energy Environ. Sci. 1277
Gelinck G H, Huitema H E A, Van Veenendaal E, Cantatore E, Schrijnemakers L, Van Der Putten J B P H et al 2004 Nat. Mater. 3 106
Nomura K, Ohta H, Takagi A, Kamiya T, Hirano M and Hosono H 2004 Nature 432 488
McAlpine M C, Ahmad H, Wang D and Heath J R 2007 Nat. Mater. 6 379
Lv H, Xu X, Liu H, Liu R, Liu Q, Banerjee W et al 2015 Sci. Rep. 5 1
Shringi A K, Betal A, Sahu S, Saliba M and Kumar M 2022 IEEE Trans. Electron Devices 69 6465
Mishchenko M A, Bolshakov D I, Lukoyanov V I, Korolev D S, Belov A I, Guseinov D V et al 2022 J. Phys. D Appl. Phys. 55 394002
Tang P, Chen J, Qiu T, Ning H, Fu X, Li M et al 2022 Appl. Sys. Innov. 5 91
Bitla Y and Chu Y H 2017 FlatChem 3 26
Jana B, Ghosh K, Rudrapal K, Gaur P, Shihabudeen P K and Roy Chaudhuri A 2022 Front. Phys. 9 822005
He Y, Dong H, Meng Q, Jiang L, Shao W, He L et al 2011 Adv. Mater. 23 5502
Bhansali U S, Khan M A, Cha D, AlMadhoun M N, Li R, Chen L et al 2013 ACS Nano 7 10518
Min Son J, Seung Song W, Ho Yoo C, Yeol Yun D and Whan Kim T 2012 Appl. Phys. Lett. 100 99
Islam S M, Banerji P and Banerjee S 2014 Org. Electron. 15 144
Jo H, Ko J, Lim J A, Chang H J and Kim Y S 2013 Macromo. Rapid. Commun. 34 355
Siddiqui G U, Rehman M M, Yang Y J and Choi K H 2017 J. Mater. Chem. C 5 862
Li Y, Cui X, Tian M, Wang G and Hao X 2021 Acta Mater. 217 117173
Li Z, Jingyu M, Yi R, Su Ting Hrval and Ye Z 2018 Small 14 1703126
Song S, Cho B, Kim T, Ji Y, Jo M, Wang G et al 2010 Adv. Mater. 22 5048
Cho B, Yun J, Song S, Ji Y, Kim D and Lee T 2011 Adv. Funct. Mater 21 3976
Lei J, Ding W-J, Liu C, Wu D and Li W M 2021 APL Mater 9 121110
Wang T, Brivio S, Cianci E, Wiemer C, Perego M, Spiga S et al 2022 ACS Appl. Mater. Interfaces 14 24565
Yun H W, Woo H K, Oh S J and Hong S H 2020 Curr. Appl. Phys. 20 288
Delfag M, Katoch R, Jehn J, Gonzalez Y, Schindler C and Ruediger A 2021 Flex Print Electron 6 35011
Samanta S, Gong X, Zhang P, Han K and Fong X 2019 J. Alloys Compd. 805 915
Bricalli A, Ambrosi E, Laudato M, Maestro M, Rodriguez R and Ielmini D 2016 IEEE J. Electron Devices Soc. 3 4
Liu C, Huang J, Lai C and Lin C 2013 Nanoscale Res. Lett. 8 1
Dong Y, Li X, Liu S, Zhu Q, Zhang M, Li J G et al 2016 Thin Solid Films 616 635
Liu Q, Long S, Lv H, Wang W, Niu J, Huo Z et al 2010 ACS Nano 4 6162
Kim J H, Nam K H, Hwang I, Cho W J, Park B and Chung H B 2014 J. Nanosci. Nanotechnol. 14 9498
Tao Y, Zhao P and Li Y 2019 Phys. Status Solidi 216 1900278
Choi B J, Torrezan A C, Norris K J, Miao F, Strachan J P, Zhang M X et al 2013 Nano Lett. 13 3213
Li P, Wang D, Zhang Z, Guo Y, Jiang L and Xu C 2020 ACS Appl. Mater. Interfaces 12 56186
Yang Y C, Pan F, Liu Q, Liu M and Zeng F 2009 Nano Lett. 9 1636
Lampert M A and Mark P (eds) 1970 Current injection in solids (New York: Academic Press)
Yang Y C, Pan F, Zeng F and Liu M 2009 J. Appl. Phys. 106 123705
Banno N, Sakamoto T, Iguchi N, Sunamura H, Terabe K, Hasegawa T et al 2008 IEEE Trans. Electron Devices 55 3283
Shacham Diamand Y, Dedhia A, Hoffstetter D and Oldham W G 1993 J. Electrochem. Soc. 140 2427
Kozicki M N and Mitkova M 2006 J. Non-Cryt. Solids 352 567
Yuan F, Zhang Z, Liu C, Zhou F, Yau H M, Lu W et al 2017 ACS Nano 11 4097
Acknowledgements
We acknowledge SERB (no. CRG/2021/000811) for partial financial support provided to this study, and the Central Research Facility (CRF) of the Indian Institute of Technology Kharagpur for various characterization facilities.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Jana, B., Gaur, P. & Roy Chaudhuri, A. Forming free bipolar resistive switching in SiOx-based flexible MIM devices. Bull Mater Sci 47, 21 (2024). https://doi.org/10.1007/s12034-023-03094-z
Received:
Accepted:
Published:
DOI: https://doi.org/10.1007/s12034-023-03094-z