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Enhanced wick-based liquid supply in patterned laser-induced graphene on flexible substrates

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Abstract

Advances in MEMS technology have enabled the development of smaller and more efficient electronic devices, integrating nanoscale components. Coupled with progress in flexible semiconductors, the potential applications of flexible electronics have significantly broadened. Yet, wearable and flexible electronics often face challenges related to thermal management owing to the low thermal conductivity of polymers—a crucial issue for wearables in direct contact with the skin. This study introduces an innovative approach to enhance wicking performance on flexible substrates aiming to improve thermal management. The approach involves creating intricate porous patterns on graphene structures through direct laser writing, using a CO2 laser on a polyimide substrate with specific parameters. Eight distinct laser-induced graphene (LIG) samples were produced, each with different laser powers ranging from 9 to 23 W. A surface analysis confirmed the successful transformation of polyimide into porous graphene through laser ablation. The surface properties were evaluated before and after the oxygen plasma treatment, supported by XRD and XPS results. The liquid transport capacity of the LIG samples was accurately measured using the capillary rate-of-rise method. Lower powers (9 and 11 W) exhibited slower rates of wicking velocity, ranging from 5.0 mm/s0.5 to 6.3 mm/s0.5, whereas higher powers demonstrated increased rates, reaching 9.5 to 13.6 mm/s0.5. These findings explicitly demonstrate the superior liquid delivery capability of LIG, achieving wicking velocities up to four times higher than those in relevant existing studies.

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Acknowledgments

This research was supported by the Challengeable Future Defense Technology Research and Development Program through the Agency For Defense Development (ADD) funded by the Defense Acquisition Program Administration (DAPA) in 2022 (No.915027201), and the Chung-Ang University Graduate Research Scholarship in 2023.

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Authors and Affiliations

  1. Department of Intelligent Energy and Industry, Chung-Ang University, Seoul, 06974, Korea

    Minsoo Kang, Junrae Park, Jung Bin In & Hyoungsoon Lee

  2. Department of Mechanical Engineering, Stanford University, Stanford, CA, 94305, USA

    Daeyoung Kong

  3. School of Mechanical Engineering, Chung-Ang University, Seoul, 06974, Korea

    Daeyoung Kong, Jung Bin In & Hyoungsoon Lee

Authors
  1. Minsoo Kang
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  2. Daeyoung Kong
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  3. Junrae Park
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  4. Jung Bin In
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Correspondence to Hyoungsoon Lee.

Additional information

Minsoo Kang received a B.S. in Mechanical Engineering from Chung-Ang University, in 2020. He is now pursuing his integrated Ph. D. in the Department of Intelligent Energy and Industry, Chung-Ang University. His main research interests are enhancing the performance and efficiency of semiconductor devices by effectively managing high heat flux.

Daeyoung Kong received Ph.D. from the Department of Intelligent Energy and Industry from Chung-Ang University, South Korea in 2023. Since 2023, he’s worked consistently in the Nanoheat group at Stanford University as a visiting postdoctoral scholar. His specialized studies focus on the development of advanced microfluidic coolers for the application of extremely high heat flux electronics.

Junrae Park received a B.S. in Mechanical Engineering from Chung-Ang University, in 2023. He is now pursuing his integrated M.S. in the Department of Intelligent Energy and Industry, Chung-Ang University. His main research interests are micro-scale cooling systems for high power semiconductor devices.

Jung Bin In is currently a Professor of Mechanical Engineering, Chung-Ang University, Seoul, South Korea. He received the Ph.D. in Mechanical Engineering from the University of California, Berkeley, CA, USA, in 2011. His research interests include micro-cooling devices, laser processing, and laser-based additive manufacturing.

Hyoungsoon Lee is an Associate Professor of Mechanical Engineering, Chung-Ang University, Seoul, Korea. He received his B.S. (2006) in Mechanical Engineering from Korea University, Seoul, Korea, and completed his M.S. (2011) and Ph.D. (2014) in Mechanical Engineering from Purdue University. His research interests include phase change heat transfer, thermal management in electronics.

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Kang, M., Kong, D., Park, J. et al. Enhanced wick-based liquid supply in patterned laser-induced graphene on flexible substrates. J Mech Sci Technol 38, 1007–1014 (2024). https://doi.org/10.1007/s12206-024-0145-6

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  • DOI: https://doi.org/10.1007/s12206-024-0145-6

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