研究领域
1. 纳米材料的制备与表征
2. 块体非晶材料及其晶化
3. 材料的纳米量热学研究
4. 纳米无铅焊料
5. 微滴凝固
6. 金属凝固及其组织控制
7. 外场下的金属凝固行为研究
8. 纳米多孔材料
近期论文
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Changdong Zou, Yulai Gao (Corresponding author), Bin Yang, Qijie Zhai. Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression. Journal of Materials Science: Materials in Electronics. 2011, accepted.
L.H. Kong, Y.L. Gao (Corresponding author), T.T. Song, Q.J. Zhai. Structure and magnetic properties of Nb-doped FeZrB soft magnetic alloys. Journal of Magnetism and Magnetic Materials. 2011. accepted
L.H. Kong, Y.L. Gao (Corresponding author), T.T. Song, G. Wang, and Q.J. Zhai. Non-isothermal crystallization kinetics of FeZrB amorphous alloy. Thermochimica Acta. 2011. DOI: 10.1016/j.tca.2011.02.013
Bin Yang, Yulai Gao (Corresponding author), Changdong Zou, Qijie Zhai, A.S. Abyzov, E. Zhuravlev, J.W.P. Schmelzer, and C. Schick. Cooling rate dependence of undercooling of pure Sn single drop by fast scanning calorimetry. Applied Physics A. 2010. DOI: 10.1007/s00339-010-6100-7
Si Chen, Lili Zhang, Johan Liu, Yulai Gao and Qijie Zhai. A reliability study of nanoparticles reinforced composite lead-free solder. Materials Transactions. 2010, 51(10): 1720-1726
ZOU Chang-Dong, GAO Yu-Lai(Corresponding author), YANG Bin and ZHAI Qi-Jie. Size-dependent melting properties of tin nanoparticles by chemical reduction synthesis. Transactions of Nonferrous Metals Society of China. 2010, 20: 248-253
Changdong Zou, Yulai Gao (Corresponding author), Bin Yang, and Qijie Zhai. Melting and solidification properties of the nanoparticles of Sn3.0Ag0.5Cu lead-free solder alloy. Materials Characterization. 2010, 61(4): 474-480
B. Yang, Y. L. Gao (Corresponding author), C. D. Zou, Q. J. Zhai, E. Zhuravlev, C. Schick. Size-dependent undercooling of pure Sn by single particle DSC measurements. Chinese Science Bulletin. 2010, 55(19): 2063-2065
Changdong Zou, Yulai Gao(Corresponding author), Bin Yang, Qijie Zhai. Synthesis and DSC study on Sn3.5Ag alloy nanoparticles used for lower melting temperature solder. Journal of Materials Science: Materials in Electronics. 2010, 21(9): 868-874
Bin Yang, Yu-Lai Gao(Corresponding author), Chang-Dong Zou, Qi-jie Zhai, Evgeny Zhuravlev, and Christoph Schick. Repeated nucleation in an undercooled tin droplet by fast scanning calorimetry. Materials Letters. 2009, 63: 2476-2478
Yulai Gao(Corresponding author), Changdong Zou, Bin Yang, Qijie Zhai, Johan Liu, Evgeny Zhuravlev and Christoph Schick. Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy. Journal of Alloys and Compounds. 2009, 484(1-2): 777-781
Jianhong Ma, Jie Li, Yulai Gao, Lixing Jia, Zheng Li, and Qijie Zhai. Improving the carbon macrosegregation in high carbon steel by electric current pulse. Metals and Materials International. 2009, 15(4): 603-608
C.D. Zou, Y.L. Gao(Corresponding author), B. Yang, and Q.J. Zhai, C. Andersson and J. Liu. Melting temperature depression of Sn-0.4Co-0.7Cu lead-free solder nanoparticles. Soldering & Surface Mount Technology. 2009, 21(2): 9-13
C.D. Zou, Y.L. Gao(Corresponding author), B. Yang, and Q.J. Zhai. Melting and undercooling of bismuth nanocrystals by solvethermal synthesis. Physica B. 2009, 404(21): 4045-4050
J.P. Liang, Y.L. Gao, R.X. Li and Q.J. Zhai. Phase evolution of AISI 321 stainless steel during directional solidification. Ironmaking and Steelmaking. 2009, 36(8): 603-609
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