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个人简介

工作经历 2010.4~至今 南京理工大学 机械工程学院 副研究员 2006.4~2010.4 南京理工大学 机械工程学院 讲师 教育经历 2003.3~2006.4 东南大学 仪器科学与工程系 博士 2000.9~2003.3 东南大学 仪器科学与工程系 硕博士 1996.9~2000.7 吉林工业大学 机械工程学院 学士

研究领域

1、MEMS设计技术,包括MEMS器件设计技术、MEMS封装技术; 2、MEMS惯性技术,包括MEMS角速率传感器和MEMS加速度传感器的设计技术、封装技术以及测试技术。

近期论文

查看导师最新文章 (温馨提示:请注意重名现象,建议点开原文通过作者单位确认)

1. Effect of stress on split mode gyroscope bias: An experimental study. in 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS). 2017. 2. Sub-degree per hour Split Mode Tuning Fork Gyroscope. International Symposium on Inertial Sensors and Systems. 2016,2. 3. Silicon vibrating beam accelerometer with ppm grade scale factor stability and tens-ppm grade full-range nonlinearity. International Symposium on Inertial Sensors and Systems. 2016,2. 4. An on-chip thermal stress evaluation method for silicon resonant accelerometer. IEEE Sensors 2016.340-342. 5. Microelectromechanical resonant accelerometer designed with a high sensitivity. Journal of Sensors.2015. Vol.(15), 30293-30310. 6. Development of MEMS inertial sensors in NUST. The 5th International Workshop on Computer Science and Engineering. 2015. 224-230.T 7. A wafer level vacuum packaged silicon vibration beam accelerometer. IEEE International Symposium on Inertial Sensors and Systems 2015 Proceedings.2015. 78-81. 8. Tactical grade MEMS gyro with low acceleration sensitivity. IEEE Sensors 2015. 2015. 630-633. 9. 高真空环境下硅微机械陀螺品质因数的温度特性.光学精密工程. 2015, 23(7),1990-1995. 10. 双质量振动式硅微陀螺理论和实验模态分析.光学精密工程. 2015, 23(2),467-476. 11. Analysis of impact of driving amplitude on resonance frequency of silicon microgyroscope. Advanced materials research (ISSN:10226680). 2015. Vol.989-994,2926-2930. 12.硅微陀螺仪零偏稳定性的优化.光学精密工程.2014. Vol.22(9),2381-2388. 13. Test and evaluation of a silicon resonant accelerometer implemented in SOI technology. IEEE sensors 2013. 2013. 14. Modeling of Nonlinear Stiffness of Micro-Resonator in Silicon Resonant Accelerometer. Key Engineering Materials. 2013. Vol. 562-565,374-379. 15. 硅微陀螺仪正交耦合系数的计算及验证[J]. 光学精密工程, 2013, 1(21): 87-93. 16.微机械陀螺检测接口建模及前置放大器优化.光学精密工程.2013. Vol.21(7),1734-1740. 17. 硅微振动陀螺仪设计与性能测试. 光学精密工程.2013. Vol.21(5),1272-1281. 18. 双质量硅微机械陀螺固有频率温度特性研究.南京理工大学学报.2013. Vol.37(1),94-100. 19. Implementation and Experiment of Dual-mass Vibratory Gyroscope with High Quality Factor. IEEE sensors 2012. 2012. 1284-1287. 20. Design and system level simulation of double-mass silicon micro gyroscope. Applied mechanics and materials. 2012. Vol.138-139,618-686. 21. A theoretical and experimental study on temperature dependent characteristics of silicon MEMS gyroscope drive mode[C]. 2010 6th International Conference on MEMS NANO, and Smart Systems. Changsha, China. Dec, 2010. 50-54. 22. Research on MEMS Gyro Random Drift Restraining based on Simplified Sage-Husa Adaptive Filter Algorithm[C]. 2010 6th International Conference on MEMS NANO, and Smart Systems. Changsha, China. Dec, 2010. 58-61. 23. A research on temperature dependent characteristics of quality factor of silicon MEMS gyroscope[C]. 2010 International Conference on Micro Nano Devices, Structure and Computing Systems. Singapore. Nov, 2010. Advanced Materials Research. 159: 399-405. 24. Analysis and design of drive closed-loop for MEMS Vibratory Gyroscope[C]. 2010 International Conference on Micro Nano Devices, Structure and Computing Systems. Singapore. Nov, 2010. Advanced Materials Research. 159: 406-411. 25. Structure Design and Simulation of Silicon Resonant Accelerometer[C]. China International Conference on Inertial Technology and Navigation. Nanjing, China. Oct 2010. 157-162. 26. 一种具有广泛适应性的微机械制造方法研究[J]. 传感技术学报. 2010.07, 23(7): 922-925. 27. Nonlinear oscillation characteristics of MEMS resonator[C]. 2010 IEEE International Conference on Mechatronics and Automation. Xi’an, China. Aug, 2010. 1250 – 1253. 28. Bulk-micromachined silicon resonant accelerometer[C]. 2009 International Conference on Information and Automation (ICIA), Zhuhai, China, Jun, 2009. 1298-1292. 29. A Study on Device Level Vacuum Packaging for Silicon MicroGyroscopes[C]. Pro. 3rd ICMEM, Beijing, China. Oct, 2009. 1570-1575. 30. MEMS陀螺仪器件级真空封装技术[J]. 光学精密工程, 2009, 17(8), 1987-1992. 31. 硅微陀螺仪器件级真空封装[J]. 机械工程学报,2009, 45(2): 243-246. 32. 硅微谐振式加速度计结构设计与仿真[J]. 中国惯性技术学报, 2009.2, 17(1): 93-97. 33. Experimental study of compensation for the effect of temperature on a silicon micromachined gyroscope[J]. Journal of Nanoengineering and Nanosystems. 2008, 222(2): 49-55. 34. 硅微陀螺仪真空封装技术研究[C]. 第六届中国惯性技术学会年会,2008.11. 310-314. 35. 双质量线振动式硅微机械陀螺仪的性能分析与测试[C]. 第六届中国惯性技术学会年会,2008.11. 325-332. 36. 硅微陀螺仪的机械耦合误差分析[J]. 光学 精密工程,2008.5, 16(5), 894-898. 37. 硅微机械陀螺仪封装应力研究[J]. 电子器件,2007, 30(6): 2294-2296. 38. Effects of Adhesive on Silicon Microgyroscopes[C]. IEEE-NEMS 2007. Bangkok, Thailand. Jan, 2007, 92-95. 39. 硅微陀螺仪的误差分析[J]. 传感技术学报. 2006, 19(5): 2182-2185. 40.Design Principle of Suspension of MEMS Gyroscope, IEEE-NEMS 2006 41.硅微机械陀螺仪结构中的电容分析.测控技术, 2005,24(11):9-12 42. 硅微型机械振动陀螺仪的计算机辅助设计. 东南大学学报. 2004,34(2):38-41. 43. 等刚度法在音叉式陀螺仪谐振频率计算中的应用.2004,12(5):49-52.

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