The cluster structure, thermochemical behavior, and some mechanisms of thermal decomposition of the crystalline products in the isodimorphic substitution series Cu x Ni(1−x)NTP (x = 0 … 1) have been studied by simultaneous the thermal gravimetric analysis and differential thermal analysis (TGA/DTA) and X-ray photoelectron spectroscopy (XPS). The complexes NiNTP and Cu1/8Ni7/8NTP with a monoclinic crystal structure are the most thermo-stable and characterized by one-step decomposition at 400–440 °C with the formation of metal phosphides and phosphates. The complexes Cu3/8Ni5/8NTP–Cu3/4Ni1/4NTP with the triclinic crystal lattice and the trigonal-bipyramidal coordination of metal atoms decompose in two steps. Firstly, the formation of a heteroligand complex with imino-bis-methylenephosphonic and methylphosphonic acids takes place at 245 °C. Secondly, the complex decomposes at 270–380 °C. The monometallic complex CuNTP decomposes almost completely at 280–300 °C.

中文翻译：

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根据 TGA/DTA 和 XPS 数据在同二晶取代系列中的晶相簇结构 [Cu x Ni(1−x){N(CH2PO3)3}]Na4·nH2O (x = 0 … 1)

同二晶型取代系列Cu中结晶产物的簇结构、热化学行为及热分解机理 X 你(1−X)NTP (X= 0 … 1) 已通过同时热重分析和差热分析 (TGA/DTA) 和 X 射线光电子能谱 (XPS) 进行了研究。NiNTP和Cu配合物1/8你7/8具有单斜晶体结构的 NTP 是最热稳定的，其特点是在 400–440 °C 下一步分解，形成金属磷化物和磷酸盐。配合物 Cu3/8你5/8NTP-铜3/4你1/4具有三斜晶格和金属原子的三角-双锥配位的NTP分两步分解。首先，与亚氨基双亚甲基膦酸和甲基膦酸形成杂配体复合物的温度为 245 °C。其次，该复合物在 270–380 °C 分解。单金属络合物 CuNTP 在 280–300 °C 时几乎完全分解。