Abstract

Using the differential scanning calorimetry method, the influence of the halogen-containing oligomer in the composition of VSK-14-6 adhesive binder on the kinetics of the curing process of prepregs on different fillers was studied and a comparative analysis of the curing kinetics of prepregs based on VSK-14-1 adhesive binder, which does not contain bromine is presented. The calculated kinetic parameters of the curing process of binders in prepregs are presented. The influence of bromine content in the binder composition on the curing process of prepregs is shown.

中文翻译：

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VSK-14-6粘合剂组成中含卤低聚物含量对不同填料预浸料固化动力学的影响及基于VSK-14-1的预浸料固化动力学对比分析粘合剂

摘要

采用差示扫描量热法，研究了VSK-14-6胶粘剂成分中的含卤低聚物对不同填料上的预浸料固化过程动力学的影响，并对预浸料的固化动力学进行了对比分析提出了基于 VSK-14-1 粘合剂的不含溴的粘合剂。给出了预浸料中粘合剂固化过程的计算动力学参数。显示了粘合剂组合物中的溴含量对预浸料固化过程的影响。