Given the tremendous growth of the microelectronics industry in recent years, soldering efficiency is more crucial than ever. Despite the great importance of the solder joints, these interconnections happen to be the weakest link in electronic packaging. Many surveys have been carried out in order to investigate their thermomechanical reliability but still incomplete since the electro-thermomechanical reliability is the one encountered in real operational services. A thorough insight into the multiphysics behavior of Pb-free solder joints is fundamental to enhancing the operational efficiency since the extent of their deterioration is a significant function of their compositions. This article investigates the response of various solder alloys (Sn63Pb37, SAC105, SAC305, SAC405, and InnoLot) to electrothermal loadings. The study explores their performance under different temperature conditions and examines factors such as melting temperature variations, residual stresses, and the impact of the IMC layer. The results highlight the superior reliability of SAC405, particularly regarding inelastic strain and premature damage. The study underscores the significance of mitigating these factors during electronics design and manufacturing to enhance solder joint lifetime. The findings contribute to advancing solder alloy reliability and improving electronic system performance.

鉴于近年来微电子行业的巨大增长，焊接效率比以往任何时候都更加重要。尽管焊点非常重要，但这些互连恰好是电子封装中最薄弱的环节。为了调查其热机械可靠性，已经进行了许多调查，但仍然不完整，因为电热机械可靠性是在实际操作服务中遇到的。彻底了解无铅焊点的多物理场行为对于提高操作效率至关重要，因为它们的劣化程度是其成分的重要函数。本文研究了各种焊料合金（Sn63Pb37、SAC105、SAC305、SAC405 和 InnoLot）对电热负载的响应。该研究探讨了它们在不同温度条件下的性能，并检查了熔化温度变化、残余应力和 IMC 层的影响等因素。结果凸显了 SAC405 的卓越可靠性，特别是在非弹性应变和过早损坏方面。该研究强调了在电子设计和制造过程中减轻这些因素以延长焊点寿命的重要性。这些发现有助于提高焊料合金的可靠性并提高电子系统的性能。