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CNC-Machined and 3D-Printed Metal G-band Diplexers for Earth Observation Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-24 Talal Skaik, Peter Hunyor, Mat Beardsley, Hui Wang, Peter G. Huggard, Yi Wang
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An Integrated TMR-based Current Sensing Solution for WBG Power Modules and Converters IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-22 Sama Salehi Vala, Abdul Basit Mirza, Fang Luo
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Compact and Broadband MSL-to-RWG Transition Using DSPSL Integrated With AQYA and Its Packaging Effect IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-22 Che-Chi Chang, Hwa-Hung Kao, You-Hao Jiang, Qun-Lin Chen, Sune-Nien Hsieh, Chun-Long Wang
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A Dual-Band Mushroom EBG Structure with Inductive Via Coupling for Wideband Parallel-Plate Mode Suppression IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-19 Da-Lin Li, Mu-Shui Zhang, Zi-Xin Wang
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Thermomechanical Modeling and Stress Analysis of Copper Inverse Opals (CIO) Structure for Capillary-Fed Boiling IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-18 Shuhang Lyu, Qianying Wu, Zheng Gong, Keyu Wang, Kenneth E. Goodson, Tiwei Wei
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Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-17 Paolo Manfredi
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On-Chip Sensors for Temperature Monitoring of Packaged GaN MMICs IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-15 Andreas Divinyi, Torbjörn M.J. Nilsson, Niklas Rorsman, Tobias Kristensen, Harald Hultin, Sten E. Gunnarsson, Mattias Thorsell
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Experimental Study on Crack Propagation of Adhesive Layer within Mini-LED Chips Needle-ejecting Peeling-off Transfer Mode IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Li Ma, Yanhui Chen, Yun Chen, Wanqun Chen, Xin Chen, Maoxiang Hou, Ching-Ping Wong, Yan Niu, Minghui Yao
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Multi-physics effect of temperature and humidity on copper wire bond degradation via enthalpy-based water-vapour energy IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Michael Joo Zhong Lim, Hai Guan Loh, Michael Goroll, Zhong Chen, Chuan Seng Tan
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Metrology of Silicon Wafers through Synchrotron Section Topography and X-ray Diffraction Imaging IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Xiao Xin, Nima E. Gorji, Ming-Lang Tseng
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Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Tim Pfahler, Sascha Breun, Lukas Engel, Christian Geissler, Jan Schür, Martin Vossiek
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Reliability Evaluation of Isolated LDMOS Devices and Condition Monitoring Solution IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-10 Rahman Sajadi, Chi Xu, Bhanu Teja Vankayalapati, Masoud Farhadi, Bilal Akin
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Design and Fabrication of a TR Microsystem in Ka Band with Si-Based 3D Heterogeneous Integration IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-09 Faxin Yu, Xi Guo, Siyuan Ma, Chenge Wang, Guangjian Feng, Zhiyu Wang
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The Temperature Cycling Characteristic of Copper Pillar Solder Joints IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-08 Yong Wang, Shifeng Yu, Junhui Li
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Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-08 Rahman Sajadi, Enes Ugur, Masoud Farhadi, Bhanu Teja Vankayalapati, Ali Saadat, William G. Vandenberghe, Bilal Akin
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Efficient Electro-Thermal Analysis of SIW Filters Considering Temperature-Dependent Characteristics of Materials IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-05 Zehao Zheng, Min Tang, Lin-Sheng Wu, Liang-Feng Qiu, Junfa Mao
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Converter-Level Packaging and Optimization for a SiC-based Grid-Interface Converter Using Discrete Devices IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-05 Abdul Basit Mirza, Kushan Choksi, Austin Zhou, Sama Salehi Vala, Fang Luo
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A Composite Probe with Parasitic Elements for Improving Sensitivity and Simultaneously Measuring Electric- and Magnetic-Fields IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-05 Lei Wang, Rong Zhou, Xiaoxian Liu, Zhangming Zhu
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77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar with Horizontally and Vertically Long and Medium Range Sensing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 M. Sun, T. G. Lim, D. S. Wee Ho, J. Q. Wu, T. C. Chai, Y. G. Ma
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Effects of Non-Gaussian Surface Roughness on Conductor Loss in High-Frequency Transmission Lines IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 Zhaokai Yang, Yixue Zhu, Hongquan Jiang, Hongwei Bao, Fei Ma
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Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 Yanghe Liu, Ercan M. Dede, Shahid Aziz Khan, Guanliang Liu, Abhilash Kamineni, Jae Seung Lee, Mengqi Wang
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High-Efficiency Low-Pass Reflectionless Filter Based on Modal Decomposition and Electromagnetic Absorber IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-04-01 Yevgeniy S. Zhechev, Mikhail S. Murmansky, Sergey V. Vlasov, Vyacheslav A. Trubcheninov, Nikita O. Kuzmin, Nikita S. Pavlov
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Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned Films IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-28 Tung-Han Chuang, Yen-Ting Chen, Yin-Hsuan Chen, Chia-Ching Chu, Chao-Sung Lin
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Sensitivity Enhancement of Microwave Split-Ring-Resonator Sensors IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-27 Mehdi Nosrati, Farzad Soltanian, Amir Nosrati
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Reliability of X7R MLCCs Under Alternating Polarity Highly Accelerated Lifetime Testing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-27 Jonathan Bock, Will Bachman, Scott Ehlers, Jack Flicker
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Two-Branch Coupling Cauer Model in IGBT Module Considering FWD Thermal Coupling Effect IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-27 Qing Yan, Aoyang Li, Gengji Wang, Jinliang Yin, Chao Dong, Mingxing Du
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High Overload Failure Rate Prediction Method for Packaged Devices Based on Stress-Strength Interference Modeling IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Tao Zhang, Xiaopeng Wu, Guangbao Shan, Yikang Wang, Jiahao Hou, Yintang Yang
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“No-clean” flux residues detection with impedance measurements IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Zsolt Tóth, Eszter Kocsis, Attila Lukács, István Szalai
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Formation of Wavy Crack in Double Layered Ag and CuO/Ag Sintering Die Attach Assemblies Subjected to Thermal Shock Testing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Daisuke Yasugi, Keisuke Wakamoto, Yuga Kumakiri, Takahiro Namazu
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Deterministic Approach to Obtain Autocatalytic Cure Kinetics Model Constants by Normal Equations of Least-Squares Method IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-26 Sukrut Prashant Phansalkar, Bongtae Han
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Simulation calculation and experimental study on the properties of Re, In, and Nb-doped Ag/Ni electrical contact materials IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-25 Jingqin Wang, Menghan Wang, Yixuan Zhang
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Pin-opt: Graph Representation Learning for Large-scale Pin Assignment Optimization of Microbumps considering Signal and Power Integrity IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-25 Joonsang Park, Seonguk Choi, Keeyoung Son, Junghyun Lee, Taein Shin, Keunwoo Kim, Boogyo Sim, Seongguk Kim, Jihun Kim, Jiwon Yoon, Youngwoo Kim, Joungho Kim
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Thermomechanical Stress Analysis, Characterization and Optimization for Double-Side Cooled Power Modules with Ceramic Substrate IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-25 Bingyang Li, Xu Yang, Kangping Wang, Min Wu, Wenjie Chen
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Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-22 Zichen Zhang, Emmanuel Arriola, Carl Nicholas, Justin Lynch, Nick Yun, Adam Morgan, Woongje Sung, Khai D.T. Ngo, Guo-Quan Lu
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3-Component Composite Phase Change Material (PCM) for Electronics Subject to Transient/Pulsed Heat Loads IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-21 Andoniaina M. Randriambololona, Vivek Manepalli, Rachel C. McAfee, Bidisha Ojha, Rahi Miraftab-Salo, Kidus Guye, Hyoungsoon Lee, Samuel Graham, Damena Agonafer
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Embedded PIN-Diode Die Interconnections with Aerosol-Jet Printing IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-21 Stephen Gonya, Mohammed Alhendi, Emuobosan Enakerakpo, Mark D. Poliks, Tom Rovere, Joseph Jendrisak, Michael Geyer, Daniel Hines
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Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-20 Adlil Aizat Ismail, Maria Abu Bakar, Azman Jalar, Zol Effendi Zolkefli, Erwan Basiron, Muhammad Nizam Ilias
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Using Particle Image Velocimetry to Visualize Jet Impingement Flow Mechanics on Modified Surfaces IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-20 Aaron H Smith, Sushil H Bhavnani, Roy W Knight
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Two-Step Ar/N2 Plasma Treatment on SiO2 Surface for Cu/SiO2 Hybrid Bonding IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-19 Sangwoo Park, Sangmin Lee, Sarah Eunkyung Kim
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Thermal Management of Non-Uniform Heat Fluxes in an Electric-Vehicle Fast-Charger: Experimental and Numerical Analysis IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-18 Joshua Palumbo, Omri Tayyara, Seyed Amir Assadi, Carlos M. Da Silva, Olivier Trescases, Cristina H. Amon, Sanjeev Chandra
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Flip Chip Bonding for SiC Integrated Circuits with Gold Stud Bumps for High Temperature Up to 600°C Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-18 Feng Li
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Packaged Microwave Displacement Sensors With Wideband Filtering Function IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-14 Zhuowei Zhang, Gang Zhang, Kam-Weng Tam, Chi-Hou Chio, Xin Zhou, Cheng Teng, Ngai Kong
In this letter, a novel packaged linear displacement sensor integrated with inherent bandpass filter (BPF) is presented. The proposed filtering sensor is composed of a multimode resonator (MMR) and a pair of transmission line. Based on the insertion phase shifts, a displacement sensing function can be obtained along with a wideband bandpass filtering response. For verification, a prototype is simulated
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A Synthesis Theory of Stripline Dual-Band Filtering Power Divider with Controllable Full-frequency Isolation IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-13 Taiyang Xie, Xiaolong Wang, Lei Zhu, Geyu Lu
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Origami-Driven Manufacturing of Reflectarrays or Transmitarrays with Feeds and Fixture IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Kuan-Yu Ko, Fei-Peng Lai, Yen-Sheng Chen
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Influence of inhomogeneous anisotropic Copper grains in TSV on the thermo-mechanical behaviors in the annealing process IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Yunpeng Zhang, Can Sheng, Shizhao Wang, Tianjian Liu, Zhongjie Gao, Sheng Liu
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Design of Absorptive Common-Mode Filters Based on Coupled Stripline λ/4 Resonator IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Yi-Hao Ma, Yu-Bin Chen, Qi-Qiang Liu, Wen-Sheng Zhao
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A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-08 Luqiao Yin, Ao Wang, Wenxing Zhu, Aiying Guo, Jingjing Liu, Min Tang, Liang Chen, Jianhua Zhang
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Solar-Thermal Synthesized Graphitic Heat Spreader for Thermally Enhanced Organic Substrates IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-07 Min Jong Kil, Eythan Lam, Mostafa Abuseada, James F. Buckwalter, Timothy S. Fisher
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Effect of warpage on solder joint fatigue life by influencing the solder joint shape in BGA packages IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-05 Wei Shen, Zhenyang Lei, Kang Liang, Gai Wu, Tian Zeng, Sheng Liu